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快捷半导体(苏州)有限公司 2017校园招聘 --- 开启梦想之旅

 公司简介

美国Fairchild Semiconductor公司 (“快捷半导体”,早期曾被翻译成“仙童半导体”)是全球首屈一指,针对多元终端市场提供高性能功率产品的供应商。快捷半导体2016年9月正式加入安森美半导体。1999 年,安森美半导体从摩托罗拉分离出来,于 2000 年成为一家上市公司。安森美半导体是高性能硅解决方案的最佳供应商,产品广泛应用于高能效电子设备、汽车、通信、计算、消费电子、工业、LED 照明、医疗、军事/航天和电力行业。安森美半导体有着世界一流运营体系、强大的供应链和遍布北美、欧洲和亚洲的制造厂、销售办事处和设计网络中心。

苏州工厂是集团公司在中国设立的一家组装及测试工厂,成立于2002年2月。公司坐落于中国新加坡苏州工业园区首期开发区内苏桐路1号,2003年6月开始正式大规模投产。公司现有员工1700左右,一期厂房占地面积约有906,000平方英尺。苏州工厂已成为集团在亚太地区重要的制造和仓储配送中心。

快捷苏州倡导以人为本的文化,我们始终在不懈的努力为员工提供一流的工作环境和共同发展的契机。让我们一起携手,共创美好未来!

招聘职位


1. Process Engineer(4):
Duties and Responsibilities
Customer Related Engineering Support.
Qualification lot overall handling & control for existing package and process.
Engineering Run Control and data collection.
Engineering material and finish good handling and control.
Engineering evaluation and report writing.
Abnormal lot handling and follow up.
Assist for product yield and quality improvement.
Other responsibility to be assigned based on the business need.
Qualifications
Bachelor degree in Engineering and Science.
Good at English.
Quick learning ability and good communication skill.
Work carefully, intelligently and with strong sense of responsibility.

2. Test Engineer(2):
Duties and Responsibilities
1.    Cooperate with different function groups for tester/handler/finishing machine purchase, setup, qualification to meet NPI requirement and schedule. 2.    Test and finishing process setup, maintenance and optimization; cost reduction activities. 3.    Test board and program develop and improvement. 4.    Product yield and quality improvement, abnormal/low yield material analysis and disposal. 5.    Provide technical/process training to Mfg operator/technicians to support production. 6.    Other duties assigned by supervisor. 
Qualifications
Bachelor degree in Engineering and Science.
Good at English.
Quick learning ability and good communication skill.
Work carefully, intelligently and with strong sense of responsibility.

3. Design Engineer(2):
Duties and Responsibilities
Tooling design for new proto type package
To make customer and preliminary design verification sample
To support Engineering work for new platform package process development
-. Engineering Run Control and data collection.
-. Engineering material and finish good handling and control.
-. Engineering evaluation and report writing.
Material property
Other responsibility to be assigned based on the business need.
Qualifications
Master degree in Engineering and Science.
Good at English.
Quick learning ability and good communication skill.
Work carefully, intelligently and with strong sense of responsibility.

4. IE Engineer(1):
Duties and Responsibilities
Time study and UPH/ capacity maintenance
Material handling tools and techniques improvement
Respective production productivity improvement.
Factory production layout management.
Qualifications
Bachelor degree .
Familiar with PPT/Excel and AutoCAD software.
Good communication skill and fluent English writing and speaking.

5. IT Engineer(1):
Duties and Responsibilities
Provide technical support and training to end-user
Resolve application related trouble-shooting case under the guide of senior application engineer.
Assist in Software vendor support management.
Intranet web site coding and maintenance
Assist in database support and maintenance
Documentation for above tasks as when necessary
Keep high sense of Confidentiality to business data and information.
Timely complete other tasks assigned by IT manager.
Qualifications
Good service mindset
Good software coding background

6. HR(1):
Duties and Responsibilities
Support HR Project and Daily Tasks
Qualifications
Bachelor degree above, major in HR or related, can work full time;
Excellent computer skills; Usage of office software well such as Excel & Word and so on;
Excellent English language skills in listening, speaking, reading and writing;
Intelligent, quick-learning and self-motivated;
Structured, logic, able to work independently;
Good communication &interpersonal skills;

招聘流程

在线申请(10.21~11.1)——>校园初试&宣讲(11.1)——>工厂参观&复试(11.8)——>offer

校园宣讲会
时间:11月1日 下午1:30
地点:本部卫校楼301室

简历申请方式

直接将简历投递至邮箱:niki.wang@fairchildsemi.com
苏州大学就业信息网直接投递
应届生求职网: http://www.yingjiesheng.com/
关注快捷半导体微信公众号,一键申请

联系方式
公司地址:苏州工业园区苏桐路1号
联系电话:67623311-86116 朱小姐,67623311-86125 王小姐
电子邮箱:sherry.zhu@onsemi.com; niki.wang@onsemi.com





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