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师资队伍
姓名:吴鸣性别:女士
学位:职称:助理研究员
所在部门:电子邮件:wming@suda.edu.cn
个人主页:

吴鸣,2016年博士毕业于法国巴黎第十一大学,之后进入苏州大学工作。主要从事薄膜吸气剂和MEMS封装相关研究工作,现正致力于晶硅纳米线晶体管的研发工作。

研究领域

1.晶硅纳米线晶体管的研究

2.薄膜吸气剂(getter)

3.MEMS封装

4.钛酸锶钡(BST)铁电薄膜在频率捷变集成微波器件的应用

 

科研项目

代表性科研成果

期刊论文:

1. M. Wu(吴鸣), J. Moulin, P. Coste, S. Perrot, J. –L. Perrossier, C. Renard, A. Bosseboeuf, Comparative study of Au/Ti, Au/V and Au/Zr films oxygen gettering ability, Thin Solid Films 616, 543-549, 2016.

2. M. Wu(吴鸣), J. Moulin, S. Lani, G. Hallais, C. Renard, A. Bosseboeuf, Low temperature activation of Au/Ti getter film for application to wafer-level vacuum packaging, Jpn. J. Appl. Phys. 54, 030220, 2015.

3. M. Wu(吴鸣), S. Lemettre, D. Mansour, M.-P. Plante, A. Bosseboeuf, S. Seok, J. Moulin, Evaporated Zr-V, Zr-Ti and Zr-Co getter thin films: activation temperature and microstructure, Microsystem Technologies (submitted).

4. M. Wu(吴鸣), J. Moulin, G. Agnus, A. Bosseboeuf, Low activation temperature Au/Ti getter films for wafer-level vacuum packaging, Electrochemical Society Transactions 64 (5), 297–304, 2014.

会议论文:

1. M. Wu(吴鸣), S. Lemettre, D. Mansour, M-P. Plante, A. Bosseboeuf, S. Seok, J. Moulin, Co-evaporated Zr-V, Zr-Ti and Zr-Co getter thin films: activation temperature and microstructure, Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 118-121, 2016.

2. M. Wu(吴鸣), J. Moulin, A. Bosseboeuf, Glancing angle deposition of Non-evaporable Au/Ti getter films, European Materials Research Society Meeting, Warsaw, Pologne, 19-22 septembre 2016. 

3. M. Wu(吴鸣), J. Moulin, S. Lani, G. Hallais, C. Renard, A. Bosseboeuf, Thermal activation of Au/Ti by interdiffusion for getter film intergration in wafer-level vacuum packaging, 4th International IEEE workshop on Low Temperature Bonding for 3D Integration, Tokoy, Japan, 07-2014.

4. M. Wu(吴鸣), J. Moulin, P.Coste, S.Perrot, J-L Perrossier, A. Bosseboeuf, Comparative study of Au/Ti, Au/V, and Au/Zr films gettering ability for application to wafer-level vacuum packaging, 26th Micromechanics and Microsystems Europe workshop, Toledo, Spain, 09/2015.

5. M. Wu(吴鸣), J. Moulin, G. Agnus, A. Bosseboeuf, Low Activation Temperature Au/Ti Getter Films for Wafer-Level Vacuum Packaging, The Electrochemical Society Meeting, Mexico, Cancun, 10-2014.

6. M. Wu(吴鸣), J. Moulin, A. Bosseboeuf, Etude de matériaux getter pour le packaging de résonateur en quartz, JNRDM 2016, Toulouse, France, 05/2016.

7. M. Wu(吴鸣), J. Moulin, G. Agnus, A. Bosseboeuf, Study of Au/Ti films gettering ability for quartz resonators vacuum packaging, JNRDM 2015, Bordeaux, France, 05/2015.

8. M. Wu(吴鸣), J. Moulin, A. Bosseboeuf, Low Activation Temperature Au/Ti Getter Films for Wafer-Level Vacuum Packaging, Journées nationales du GDR/MNS(Micro et Nanosystème), Polytechnique, France, 07/2014.

9. J. Moulin, A. Bosseboeuf, S. Seok, P. Coste, N. Isac, S. Perrot, J. Rizzi, M. Wu (吴鸣), S. Lemettre, Wafer bonding and getter films for low temperature vacuum wafer-level packaging, 13th NAMIS international workshop, Wroclaw, Pologne, 10-11 septembre, 2015.

10. A. Ghalem, F. Ponchel, M. Wu(吴鸣), D. Remiens, T. Lasri, Réalisation de capacités interdigitée à partir de films minces ferroélectriques dans le domaine de fréquence RF et millimétrique, JNRDM 2013, Grenoble, pp. 85-89, 2013.

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